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Faamatalaga o oloa

Talosagaina Herometic Houstings mo RF & Microwave Modules

Oloa Valiega

O la matou tulaga masani o le herometic o le sili fofo mo le puipuia o le maaleale rf ma microwave tele-chip modules (msm) ma hymbis). O lenei faʻapitoa foliga o le eletise eletise e afifiina ai se malosi, hermetacally faʻamaufaʻailogaina "bathothub" e mautinoa ai le umi-taimi o lau eletise-masani. I le tuʻufaʻatasia o se maualuga-faʻataʻitaʻi uʻamea faʻavae ma se pa puipui o le palu ma le maualuga-isopration chrambic addresslucs, tatou faia se siosiomaga totonu ma le afaina. O nei faiga e faʻauʻuina ai le puleaina o le pulega sili o le siosiomaga, lelei eletise eletise i le kulu-beal, ma ua fausia e feaveaʻi ai tulaga sili ona faigata.

FAAMATALAGA FAAMASINOGA

Parameter	Specification
Application	RF/Microwave Multi-Chip Modules (MCMs), Hybrid Integrated Circuits (HMICs)
Frequency Range	DC to C/X/Ku bands and higher
Hermeticity	≤ 1x10⁻⁹ Pa·m³/s (He), meeting MIL-STD-883 standards
Base Material	Tungsten Copper (WCu), Molybdenum Copper (MoCu) for CTE matching and heat spreading
Wall & Lid Material	Kovar (e.g., 4J42, 4J34) for reliable hermetic sealing
Feedthrough Insulator	High-purity Alumina ($Al_2O_3$) Ceramic for low-loss signal transmission
RF I/O Options	50Ω impedance-matched feedthroughs available
Compliance Standards	Designed to meet GJB2440A-2006 (General specification for packages of hybrid integrated circuits)

Oloa ata

A custom-built hermetic metal housing for high-frequency RF and microwave modules

Mafuaaga ma le lelei

Misiona-mea taua ole talitonuina: O se faʻailoga moni e maua ai le puipuiga sili agaʻi i ituaiga o siosiomaga, ma faʻamautinoaina le faʻamalieina o lau forutu o loʻo ia te aʻu o talosaga.
Maualuga maualuga-masani gaioiga: o le maualalo-difrac cratractractracros e tumau le faʻamaoni manino mo faʻailoga maualuga, faʻaititia le paʻu.
Lelei le faʻatautaia o le Hormal Managel: O le maualuga-faʻatonuga wcu poʻo le mokecu bandly e sili atu le faʻaaogaina o le vevela mai le tele o masini-malosi eletise i le system chassis.
I totonu o le EMIS EMI Taliping: O le faifai pea o le umi o le uafu e maua ai le lelei eletise eletise, puipuia faalavelave ma le mautinoa le manino mama.
Atoatoa tulaga lelei: Matou te faʻapitoa i le fausiaina o tulaga masani o vaevaega, o le cavity e lapoʻa, ma aʻu / o faʻatonuga e fetaui lelei ma lau puipuiga i totonu.

Talosaga Tulaga

O nei aga masani o le faʻavae o le faʻavae o le lautele o le lautele o tulaga maualuga:

Transmit / Maua (T / R) Modules mo AESA radir faiga
Up / lalo o le au liliu mo satelite fesootaiga feololo
Eletise eletise ma faailo le poto (simin) modules
Maualuga-masani taimi faʻataʻitaʻi ma mea e maua ai le fuataga

Faamanuiaga mo tagata faatau

Puipui lau IP ma tupe teu: O le malosi, o le mea e mafai ai ona puipuia le mea e puipuia ai lau mea taua.
Faʻamaonia maualuga tuʻufaʻatasia: O le tulaga masani e faʻatagaina ai le tuʻufaʻatasia o le tele o le tele o mmics, anics, ma le pasiaina o le tino.
Faʻaititia le tulaga lamatia: Paaga ma o matou tagata atamamai i le Wireless RF o loʻo afifiina o se fofo e sili ona lelei mo le faʻamoemoega ma le ulufale mai o le amataga mai le amataga.

FAQ (masani fesili fesili)

Q1: O le a le auala mo le fuafuaina o se fale masani fale?

A1: O le faʻagasologa e amata i ou manaʻoga, e aofia ai le faʻatulagaina o totonu, chip nofoaga, i / o faʻatulaga, ma le vevela avega. O le matou inisinia lea e faʻaaoga ai lenei faʻamatalaga e mamanuina le afifi, faia le vevela ma le fausaga faʻataʻitaʻi e faʻamaonia ai le mamanu aʻo leʻi mauaina prototypes prototypes.

Q2: O le a le faʻamatalaga o loʻo faʻaaoga i totonu o nei afifi?

A2: O nei afifi na mamanuina ma le Kvar Jeal Ring, faia ia latou lelei mo le maualuga o le sili ona mautinoa o pepa faʻapipiʻi e pei o le pipili faʻailoga.

Q3: Aisea e faʻaaogaina ai le apamemea o le Tungsten (WCU) mo le faʻavae?

A3: Wà o se vevela vevela vevela stink mea mo nei tusi talosaga aua e tuʻufaʻatasia le malosi o le vevela o le vevela ma le maualalo o le lautele lautele (cte). O le maualalo o le CTE e fetaui lelei o le ceramic e suia (pei o le Alumina) ma semponductor Chips (pei o Gaas), o le a le faʻaititia le faʻafitauli o le vevela i le taimi o le vevela suia.

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